Flexres 35

A two-component, room temperature curing, electrical encapsulant specifically formulated to seal, protect and preserve the electrical characteristics of delicate electronic circuits in severe environments. A low exotherm potting system with exceptional adhesion.

A two-component, room temperature curing, tough and flexible polyurethane encapsulating resin system.

Excellent adhesion to wiring and casings in low temperatures and in cycling temperatures.

Characterised by a low exotherm, low volume shrinkage and good penetration, elasticity and resistance to tracking.

Applications include the sealing of cable joints, jointing of bus-bars and potting transformers and electronic components.

The system is solvent free and can be mixed and cured at room temperature.